METALLURGICAL
Denser deposit
Finer grain deposit
Lower porosity
Higher tensile strength
Higher elongation
Reduced stress
Reduce hydrogen embrittlement |
PHYSICAL
Fills submicron trenches
Improved adhesion of deposit
Reduced stress on photo resists
Increased throwing power
Control of alloy composition
Uniform thickness
Improved chem. milling |
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ELECTRICAL
Higher conductivity
Lower contact resistance
Better bondability |
GENERAL
Metal concentration in bath
Reduce additives
Reduce plating time 10 - 20% |
Dynatronix maintains
a library of electroplating papers and articles
covering a variety of metals and applications. Many of these
articles are available in PDF
format here on the Dynatronix web site. Please contact us
at (800)-826-7172 if you do not find information on the
specific topic you are looking for.
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