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Dynatronix maintains a library of
articles back to 1972. It includes articles on most metals
and a range of applications. Some are quite technical and
some are quite basic. Please contact us at sales@dynatronix.com if you don't
see what you are looking for below.
Articles available online:
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An Overview of Pulse Plating
Plating & Surface Finishing, March 1986
Norman Osero, President, Dynatronix
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Stainless
Steel Pulse Electropolishing
Pat
Mentone, 2003
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Rectifying Electronics Finishing
What you Need to Know
Finisher's
Management, January 2002
Pat F. Mentone
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Throwing
Power in Pulse Reverse, Plating from Acid Copper Bath
CAG Centre of Advanced Electroplating
P. Leisner, G. Bech-Nielsen & P. Moller
C.A.G., Denmark
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Pulse Plating - General
Enthone-OMI
Chuck Van Horn, Industry Specialist
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Improvements of Nickel Deposit Characteristics
by Pulse Plating
CAG Centre of Advanced Electroplating
Peter Tang, Peter Leisner, Per Moller
C.A.G., Denmark
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Nickel Electroforming using Pulse Periodic Reverse
AESF Sur-Fin Pulsed Plating Workshop
June 18, 1993
Al Koster, Pat Mentone, Jody West
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Current Distribution in Selective Pulse Plating
(Gold)
Plating & Surface Finishing
October 1989
and
Selective Pulse Plating of Gold & Tin/Lead Solder
Plating & Surface Finishing
February 1991
D.T. Chin, N.R.K. Vilambi,
M.K. Sunkara
AESF Research Project #68
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AMD Develops Electroplated Copper Damascene Process
Semiconductor International, August 1997 issue
- Pulse
Periodic Reverse Copper Plating of High Aspect Ratio Holes
IPC Printed Circuits
Expo 1997
March 9 - 13, 1997
K J Whitlaw
LeaRona
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©2006,
Dynatronix, 462 Griffin Blvd, Amery, WI, USA 715.268.8118 Fax:
715.268.8183 Toll Free: 800.826.7172 |
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